| PART |
Description |
Maker |
| M36L0T7050B2 M36L0T7050B2ZAQ M36L0T7050B2ZAQE M36L |
128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package
|
Numonyx B.V
|
| M36L0R8060T1ZAQE M36L0R8060T1ZAQF M36L0R8060T1ZAQT |
256 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package
|
STMICROELECTRONICS[STMicroelectronics]
|
| M36P0R9070E0_06 M36P0R9070E0 M36P0R9070E0ZAC M36P0 |
512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 128 Mbit (Burst) PSRAM, 1.8V supply, Multi-Chip Package
|
STMICROELECTRONICS[STMicroelectronics]
|
| CMCM |
Ceramic Multi-Chip Module Package
|
Amkor Technology, Inc.
|
| WED3C755E8M300BC WED3C755E8M350BC WED3C755E8M350BI |
RISC MICROPROCESSOR MULTI-CHIP PACKAGE
|
WEDC[White Electronic Designs Corporation]
|
| 23-22C-S2BHC-B30-2A |
Reverse Package Chip LED (Multi-Color)
|
Everlight Electronics Co., Ltd
|
| 23-22C-S2BHC-B30-2A11 |
Reverse Package Chip LED (Multi-Color)
|
Everlight Electronics Co., Ltd
|
| TH50VSF3580AASB |
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| AM41DL3208G AM41DL3208GB30IT AM41DL3208GB35IT AM41 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION
|
| MB84VD23381FJ MB84VD23381FJ-80PBS |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & FCRAM
|
Fujitsu Component Limited.
Fujitsu Limited
|
| W3H32M64E-XSBX W3H32M64E-400ES W3H32M64E-400ESC W3 |
32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
|
WEDC[White Electronic Designs Corporation]
|
| TY00680002/003ADGB |
Pseudo SRAM and NOR Flash Memory Mixed Multi-Chip Package
|
TOSHIBA
|
